On June 23, the whistleblower Majin Bu recently released spy photos of iPhone 17 Pro components, showing the heat spreader cooling system on Apple models for the first time.

From the pictures, the iPhone 17 Pro uses copper heat dissipation components, which are similar in structure to Android models, and its heat dissipation efficiency is far higher than the graphene heat sink on the current iPhone.

The heat spreader is mainly composed of sealed metal walls and a small amount of liquid. When the heat source such as the mobile phone SoC emits heat, the liquid will be heated and vaporized, flow to the other side with less heat, and then cool and liquefy and reflux, and circulate continuously to dissipate heat.

It should be noted that the current Android flagship heat spreader area is huge. In contrast, the iPhone 17 Pro is a bit like the "playing house" level, and the actual effect is still questionable.

However, the iPhone 17 Pro will also use a spliced ​​body, and the upper part of the back shell is made of aluminum alloy, which will also enhance the heat dissipation of the SoC area.

Below the camera is glass to ensure the normal use of wireless charging and MagSafe magnetic suction.

In terms of core configuration, the iPhone 17 Pro series is equipped with an A19 Pro chip, which is built based on TSMC's 3nm process. In addition, it has been upgraded to 12GB of memory, which will be the model with the largest memory in Apple's history.